Hello, my name is KS
This is purely for my personal record.
Design Rules : Surface Mount Technology
Design Rules : Stub Bump
Design Rules : Flip Chip
Design Rules : Wire Bond
Design Rules : Underfil
Design Rules : Glass Attach
Design Rules : Camera/Receiver Active Alignment (CM/RX AA)
Design Rules : Laser Soldering
Design Rules : Anisotropic Conductive Film (ACF)
Design Rules : Laser Marking
