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Using high resolution AF camera + flexible lighting for precise mechnical dimension measurement.

Using white light inteferometry or/and confocal scanning method to measure the 3D structure or surface profile, generate depth map.

Using high magnification optics system to allow manual visual inspection.

Using ultrasound wave, pulses of different frequencies are used to penetrate material to examine interiors for voids or delamination.

SEM: Electron beam shooted and get back info like BackScatterEd (atomic # delta) & 2nd Electron (topographic), generate fine texture gray scale image.

EDX: Consist of Silicon-Drift Detectors(SDD) to measure the X ray photon energy, providing spectra with peak (X=number of count, y=energy). This is used to analyse the composition of the material.

Using IR and measure the infrared absorption or reflectance spectrum to determine vibrational frequencies, which provides information on chemical structure and bonding. Good for organic and polymer material analysis.

Using water droplet on a surface, measure the angle form between droplet and surface, resulting surface wettability & hydrophobicity. Check cleanliness of a surface.

Using X-rays beams collimated to create a line, then translated across the part and data is collected by the detector. The data is then reconstructed to create a 3-D image. Good to check the internal component dimension and assembly flaw.

Using Xray (high energy electromagnetic radiation, 10nm-10pm) to inspect inner component crack/damage.

DSC measures heat flow of a sample over a temperature range, help to determine glass transition, cystalisation & melting temperature, used to analyse if an applied epoxy is fully cured.

Using multiple colimator lens vision or chart, to measure optical characteristic like MTF, DFOV, FL... of an optics product or lens.

HSC (high throughput, high frame rate) help to capture video for extreme fast/fine machine mechanism, help to optimise machine sequence/delay.

It help to capture information on electrical signals for debugging, analysis, or characterization. The displayed waveform can then be analyzed for properties such as amplitude, frequency, rise time, time interval, distortion, and others

It apply a swept (automatically continuously varying with time) voltage to two terminals of the device under test and measure the amount of current that the device permits to flow at each voltage(I-V curve), used to detect if circuit broken.

It help to determine the characteristics of electrical lines by observing reflected pulses, used to detect if circuit intermittent/broken.

Submerge a speciment in red ink/dye for a period(let dye penetrate all area), then dry it and proceed separation, inspect the presence of dye around interconnecting area. Used to detect if interconnect cracked/lifted.

Place a speciment in potting cup, pour in resin until full, vacuum, dry, grinding. Microscope/SEM to examine the mechnical defect or structure of the layer.

Using ion beam to mill the specimen in fine rate, while imaging the newly exposed surface using an electron beam(SEM). Objective same as X-sect, but without any mechanical stress applied and no debris from grinding that impact the imaging step.